Super-curing has officially launched its new Electronic Application Series of UV curing adhesives, adding a set of dedicated grades designed for the fast-moving consumer electronics assembly market. The series brings together five new products that cover the full device-production workflow — from phone sealing gaskets and earphone solder joints to speaker voice coils, formed-in-place gaskets and camera module thread locking.
As devices become thinner and production lines faster, manufacturers need adhesives that cure in seconds, work without ovens and protect increasingly delicate parts. The Electronic Application Series answers this with LED/UV curable, solvent-free formulations engineered for high-throughput, automated assembly. The new lineup includes five grades dedicated to the most common electronics bonding and sealing tasks.
| Model | Application | Highlights |
| 3508 | Phone sealing gasket (FIPG) | Solvent free, wave/reflow resistant, high thixotropy, compression rebound |
| 3572 | Earphone solder joint protection & component fixing | High toughness, low shrinkage, low dielectric, 3-5s LED cure |
| 3578 | Voice coil & diaphragm bonding | High adhesion, low stress, red visible, 3-5s LED cure |
| 3598 | Formed-in-place gasket sealing | Solvent free, compression rebound, heat/water/corrosion resistant |
| 3103 / 3108 | Camera module thread locking | Fast cure, high strength, high hardness, heat resistant |
Rather than five separate products, the Electronic Application Series is a coordinated toolkit. Because every grade shares the same UV/LED curing platform and solvent-free chemistry, manufacturers can standardize curing equipment and process parameters across several assembly steps. A single lamp setup can serve sealing, fixing, bonding and thread locking, which reduces equipment complexity and operator training while improving overall line efficiency.
Across the industry, demand for slimmer devices, waterproof designs and faster cycle times continues to rise. By expanding its UV adhesive range with dedicated electronics grades, Super-curing helps manufacturers respond to these trends without sacrificing reliability. Each product was validated for the bonding, sealing and locking tasks it is designed to perform, giving customers a dependable starting point for new projects.
The Electronic Application Series is now available with flexible packaging options to suit different production volumes. Samples are available for evaluation, and our technical team can recommend the most suitable grade for each application. To learn more or request a sample, contact us today.
تماس با شخص: Mr. Eric Hu
تلفن: 0086-13510152819